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TSMC has revealed new details about 3-nanometer processors

17 July 2020, Friday By M. Konwar
Two years ago, chipmaker TSMC launched mass production of mobile platforms manufactured in accordance with the 7-nm process. Recently, the company planned to release 5-nanometer chips, which have already been pre-ordered by Apple and HUAWEI. Now the vendor has started the final stages of developing 3-nm solutions, revealing to journalists some of the features of the upcoming new products.


According to the TSMC roadmap, the production of the first 3-nanometer process processors should begin at the end of 2021. Compared with 5-nm technology, the density of new transistors will increase by 15%, performance - by 10-15%, and energy efficiency - by 20-25%.

The production process will use the usual FinFET transistor layout technology when creating new chips. It is expected that in 2022, one of the key customers of 3-nanometer processors will be Apple, which is interested in the release of the Apple A16 Bionic chip for iPhone and iPad.

As for the 5-nanometer technology, the first processor manufactured according to the new standards will be the Qualcomm Snapdragon 875, which is expected to be presented in early 2021. In addition to the Cortex-A78, the chip will receive a special core Super Core Cortex X1, which can provide a 30% increase in gadget performance compared to the Cortex-A77.
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